The composition of “flux” mainly consists of the following components. At high temperatures, a film can be formed on the metal surface to isolate air, so that the paste is not easily oxidized. The main function of “flux” is to remove oxides and dirt from the metal surface. The melting point of tin (Sn, 42%) and vanadium (Bi, 58%) of SnBi alloys are 138 degrees C, while the melting point of SnBiAg is 178 degrees C (Sn, 64%), vanadium (Bi, 35%), and silver (Ag, 1%). Second, there is the use of SnBi or SnBiAg alloys for cryogenic tin paste. In the case of SAC305, which is currently the most used, tin paste with a ratio of tin (Sn, 96.5%), silver (Ag, 3%), and copper (Cu, 0.5%) SAC0307, on the other hand, uses tin (Sn, 99%), silver (Ag, 0.3%), copper (Cu, 0.7%) ratio of tin paste. In some cases, manufacturers have a special patented formula to make it different from other brands. There are a number of manufacturers of tin powder and the formulas have different composition ratios. The tin powder is a metal alloy, the main use in providing weldability and welding strength. The following will help explain the contents and importance of these two ingredients. The composition of tin paste is mainly a combination of flux and powder. The main ingredients of tin paste flux and tin powder. The main purpose of solder paste is to weld electronic parts to the circuit board while providing the critical electronic signal connectivity needed for the electronic equipment to function as designed. This process helps to keep all the parts in the proper position even under some vibration. ![]() The solder paste is essential to securely weld the components to the circuit board electronic parts. The tin paste is called “paste” because it has a similar consistency to the toothpaste we brush our teeth with every day. Solder paste helps the world to enjoy the benefits of electronic equipment. Solder paste is one of the most important materials used today in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole components by printing solder paste in and over the holes.
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